Jetson ORIN AGX 64 GB SOM
JETSON ORIN AGX SOM - 64 GB
Jetson ORIN AGX 64 GB SOM
GPU: |
NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor Cores |
CPU: |
12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
DL Accelerator: |
2x NVDLA v2.0 |
Vision Accelerator: |
PVA v2.0 |
Memory: |
64GB 256-bit LPDDR5 204.8 GB/s |
Storage: |
64GB eMMC 5.1 |
Power: |
15W - 60W |
Networking: |
1x GbE 4x 10GbE |
Display: |
1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
AI Performance: |
275 TOPS (INT8) |
Max GPU Freq: |
1.3 GHz |
CPU Max Freq: |
2.2 GHz |
DLA Max Frequency: |
1.6 GHz |
CSI Camera: |
Up to 6 cameras (16 via virtual channels*) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps) |
Video Encode: |
2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) H.264, AV1 |
Video Decode: |
1x 8K30 | 3x 4K60 | 7x 4K30 | 11x 1080p60| 22x 1080p30 (H.265) H.264, VP9, AV1 |
UPHY: |
Up to 2 x8, 1 x4, 2 x1 (PCIe Gen4, Root Port & Endpoint) 3x USB 3.2 Single lane UFS |
Other I/O: |
4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
Mechanical: |
100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
Specification
GPU: |
NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor Cores |
CPU: |
12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
DL Accelerator: |
2x NVDLA v2.0 |
Vision Accelerator: |
PVA v2.0 |
Memory: |
64GB 256-bit LPDDR5 204.8 GB/s |
Storage: |
64GB eMMC 5.1 |
Power: |
15W - 60W |
Networking: |
1x GbE 4x 10GbE |
Display: |
1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
AI Performance: |
275 TOPS (INT8) |
Max GPU Freq: |
1.3 GHz |
CPU Max Freq: |
2.2 GHz |
DLA Max Frequency: |
1.6 GHz |
CSI Camera: |
Up to 6 cameras (16 via virtual channels*) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps) |
Video Encode: |
2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) H.264, AV1 |
Video Decode: |
1x 8K30 | 3x 4K60 | 7x 4K30 | 11x 1080p60| 22x 1080p30 (H.265) H.264, VP9, AV1 |
UPHY: |
Up to 2 x8, 1 x4, 2 x1 (PCIe Gen4, Root Port & Endpoint) 3x USB 3.2 Single lane UFS |
Other I/O: |
4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
Mechanical: |
100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
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